专用IC-芯片组-AF82801JDO

参数	数值
# of SATA Ports	6
# of USB Ports	12
Embedded Options Available	Yes
Integrated IDE	None
Integrated LAN	10/100/1000
Intel® AC97 Technology	No
Intel® Active Management Technology	Yes
Intel® HD Audio Technology	Yes
Intel® Matrix Storage Technology	Yes
Intel® Quick Resume Technology	Yes
Intel® Quiet System Technology	Yes
Intel® Trusted Execution Technology	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Launch Date	Q3'08
Low Halogen Options Available	See MDDS
Max TDP	4.5 W
Package Size	31mm x 31mm
Recommended Customer Price	T&R : $20
Status	Launched
Supplemental SKU	No
T CASE	105°C
USB Revision	USB 2.0

这些多核处理器基于英特尔® 酷睿™ 微架构和 45 纳米技术，并具备增大的高速缓存容量；它们提高了多线程应用和多任务环境的计算能力，以满足要求高性能、低能耗的嵌入式应用的需求。

英特尔® 虚拟化技术： 在单一硬件平台上实现多个环境以提高灵活性和系统利用率。
英特尔® 可信执行技术： 实现测量启动和保护执行等安全性功能。
英特尔® 高级智能高速缓存： 通过动态分配共享的二级高速缓存而提高系统性能。
英特尔® 64 架构： 支持 64 位指令。

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AF82801JDO

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序号	PDF	描述
1	Application Note: AP-485 Intel® Processor Identification and CPUID Instruction	Application Note: AP-485 Intel® Processor Identification and CPUID Instruction
2	Application Note: Designing Embedded Systems for Testability	Application Note: Designing Embedded Systems for Testability
3	Datasheet: Intel® 4 Series Express Chipset Family	Datasheet: Intel® 4 Series Express Chipset Family
4	Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller	Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
5	Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller	Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
6	Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and	Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series
7	Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and	Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series
8	Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family	Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family
9	Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual	Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual
10	Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide	Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide
11	Power Profiling for Embedded Applications	Power Profiling for Embedded Applications
12	Product Brief: Intel® 82576 Gigabit Ethernet Controller	Product Brief: Intel® 82576 Gigabit Ethernet Controller
13	Product Brief: Intel® 82576 Gigabit Ethernet Controller	Product Brief: Intel® 82576 Gigabit Ethernet Controller
14	Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/	Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/SCADA Industrial Panel PC
15	Specification Update: Intel® 82576 Gigabit Ethernet Controller	Specification Update: Intel® 82576 Gigabit Ethernet Controller
16	Specification Update: Intel® 82576 Gigabit Ethernet Controller	Specification Update: Intel® 82576 Gigabit Ethernet Controller
17	Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor	Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series -NDA
18	Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family	Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family
19	Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family	Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family
20	Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family	Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family
21	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
22	White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model	White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model
23	White Paper: Choosing the Right Storage Solution for Your Embedded Application	White Paper: Choosing the Right Storage Solution for Your Embedded Application
24	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
25	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
26	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
27	White Paper: Designing Systems without a Suspend Supply	White Paper: Designing Systems without a Suspend Supply
28	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
29	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
30	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
31	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
32	White Paper: Interfacing I²C Devices to Intel's SMBus Controller	White Paper: Interfacing I²C Devices to Intel's SMBus Controller
33	White Paper: JTAG 101	White Paper: JTAG 101
34	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
35	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
36	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
37	White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture	White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems
38	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
39	White Paper: Seven Tips to Get Started on Embedded Multi-Core	White Paper: Seven Tips to Get Started on Embedded Multi-Core
40	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
41	White Paper: Thermal Design Considerations for Embedded Applications	White Paper: Thermal Design Considerations for Embedded Applications
42	White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane	White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane
43	产品简介：适用于嵌入式计算的英特尔® Q45 高速芯片组	产品简介：适用于嵌入式计算的英特尔® Q45 高速芯片组
44	产品简介：适用于嵌入式计算的英特尔® Q45 高速芯片组	产品简介：适用于嵌入式计算的英特尔® Q45 高速芯片组
45	产品简介：英特尔® 奔腾® 处理器 E6500、E5300 和 E2160	产品简介：英特尔® 奔腾® 处理器 E6500、E5300 和 E2160
46	支持嵌入式计算的英特尔® 酷睿™2 四核处理器 Q9400	支持嵌入式计算的英特尔® 酷睿™2 四核处理器 Q9400
47	支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300	支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300