AM82801IUX

品牌:Intel
描述:Intel? 82801IUX-SFF I/O Controller
包装:
封装:
无铅情况/ROHS: 有铅
类别:芯片组
经营商:科通芯城自营
参数 数值
# of SATA Ports 4
# of USB Ports 12
Embedded Options Available Yes
Integrated IDE 1 Channel
Integrated LAN 10/100/1000
Intel® AC97 Technology Yes
Intel® Active Management Technology No
Intel® HD Audio Technology Yes
Intel® Matrix Storage Technology No
Intel® Quick Resume Technology No
Intel® Quiet System Technology No
Intel® Trusted Execution Technology Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Launch Date Q3'07
Low Halogen Options Available See MDDS
Max TDP 2.5 W
Package Size 16mm x 16mm
PCI Support 4 (32/33)
Recommended Customer Price T&R : $21
Status Launched
Supplemental SKU No
USB Revision USB 2.0

这些芯片组针对快速部署而优化,提供稍不相同的功能,有些经过英特尔® 酷睿™2 双核处理器 T9400Δ、SL9400Δ 和 SP9300Δ、英特尔® 赛扬® M 处理器 722Δ或英特尔® 赛扬® 处理器 575Δ认证。它们在对温度要求较高的应用程序中提供了各种不同的高性能解决方案。


  • 英特尔® 虚拟化技术: 允许硬件平台作为多个虚拟平台。
  • 英特尔® 可信执行技术: 防止基于软件的攻击,并帮助保护数据。
  • 英特尔® 64 架构: 支持 64 位指令。

交互式结构图



文档(Document)

序号 PDF 描述
1 "用于嵌入式计算的英特尔® 酷睿™ 2 双核处理器 T9400、P8400、SL9400、SL9380、SP9300、SU9300、T7500、 T7400、L7500、L7400 和 U7500 处     "用于嵌入式计算的英特尔® 酷睿™ 2 双核处理器 T9400、P8400、SL9400、SL9380、SP9300、SU9300、T7500、 T7400、L7500、L7400 和 U7500 处理器"
2 Application Note: Designing Embedded Systems for Testability     Application Note: Designing Embedded Systems for Testability
3 Datasheet: Intel® 82574 GbE Controller Family     Datasheet: Intel® 82574 GbE Controller Family
4 Datasheet: Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series     Datasheet: Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series
5 Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family     Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family
6 Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Mobile Processor, Intel®     Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Mobile Processor, Intel® Core™2 Extreme Mobile Processor on 45-nm Process
7 Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR2 System Memory) Development Ki     Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR2 System Memory) Development Kit User Manual
8 Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR3 System Memory) Development Ki     Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR3 System Memory) Development Kit User Manual
9 Intel® Core™2 Duo Processors on 45-nm Process Processor for Embedded Applications Thermal Design Gui     Intel® Core™2 Duo Processors on 45-nm Process Processor for Embedded Applications Thermal Design Guide
10 Mobile Intel® 4 Series Express Chipset Family     Mobile Intel® 4 Series Express Chipset Family
11 Power Profiling for Embedded Applications     Power Profiling for Embedded Applications
12 Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture     Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture
13 Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers     Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
14 Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers     Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
15 Solution Brief: Unwiring the Patient — Using Intel® technologies to create a wireless sensor platfor     Solution Brief: Unwiring the Patient — Using Intel® technologies to create a wireless sensor platform for hospitals
16 Specification Update: Intel® 4 Series Express Chipset     Specification Update: Intel® 4 Series Express Chipset
17 Specification Update: Intel® 82574 GbE Controller Family     Specification Update: Intel® 82574 GbE Controller Family
18 White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets     White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
19 White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model     White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model
20 White Paper: Choosing the Right Storage Solution for Your Embedded Application     White Paper: Choosing the Right Storage Solution for Your Embedded Application
21 White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs     White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
22 White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms     White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
23 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
24 White Paper: Designing Systems without a Suspend Supply     White Paper: Designing Systems without a Suspend Supply
25 White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles     White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
26 White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms     White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
27 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
28 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
29 White Paper: Interfacing I²C Devices to Intel's SMBus Controller     White Paper: Interfacing I²C Devices to Intel's SMBus Controller
30 White Paper: JTAG 101     White Paper: JTAG 101
31 White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization     White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
32 White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons     White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
33 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
34 White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture     White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems
35 White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts     White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
36 White Paper: Seven Tips to Get Started on Embedded Multi-Core     White Paper: Seven Tips to Get Started on Embedded Multi-Core
37 White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines     White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
38 White Paper: Thermal Design Considerations for Embedded Applications     White Paper: Thermal Design Considerations for Embedded Applications
39 White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane     White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane
40 White Paper: Using Intel® Processors for DSP Applications: Comparing the Performance of Freescale MP     White Paper: Using Intel® Processors for DSP Applications: Comparing the Performance of Freescale MPC8641D* and Two Intel® Core™2 Duo Processors
41 面向嵌入式计算的45 纳米英特尔® 赛扬®和     面向嵌入式计算的45 纳米英特尔® 赛扬®和
42 英特尔® 酷睿™2 双核处理器和移动式英特尔® 4 高速芯片组系列开发套件 高速芯片组系列开发套件     英特尔® 酷睿™2 双核处理器和移动式英特尔® 4 高速芯片组系列开发套件 高速芯片组系列开发套件
43 英特尔® 赛扬® M 处理器 575     英特尔® 赛扬® M 处理器 575
44 支持嵌入式计算的移动式英特尔® GM45、GS45 和 GL40 高速芯片组     支持嵌入式计算的移动式英特尔® GM45、GS45 和 GL40 高速芯片组

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