AT80571PH0723M

品牌:Intel
描述:Intel? Core?2 Duo Processor E7400 (3M Cache, 2.80 GHz, 1066 MHz FSB)
包装:
封装:
无铅情况/ROHS: 有铅
类别:酷睿处理器
经营商:科通芯城自营
参数 数值
# of Cores 2
# of Processing Die Transistors 228 million
# of Threads 2
AES New Instructions No
Bus/Core Ratio 10.5
Clock Speed 2.8 GHz
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Execute Disable Bit Yes
FSB Parity No
FSB Speed 1066 MHz
Idle States Yes
Instruction Set 64-bit
Intel® 64 Yes
Intel® Demand Based Switching No
Intel® Hyper-Threading Technology No
Intel® Trusted Execution Technology No
Intel® Turbo Boost Technology No
Intel® Virtualization Technology (VT-x) See SPEC Details
L2 Cache 3 MB
Launch Date Q1'08
Lithography 45 nm
Low Halogen Options Available See MDDS
Max TDP 65 W
Package Size 37.5mm x 37.5mm
Processing Die Size 82 mm 2
Processor Number E7400
Recommended Customer Price TRAY: $116 BOX : $125
Sockets Supported LGA775
Status Launched
Supplemental SKU No
T CASE 74.1°C
Thermal Monitoring Technologies Yes
VID Voltage Range 0.8500V-1.3625V

这些多核处理器基于英特尔® 酷睿™ 微架构和 45 纳米技术,并具备增大的高速缓存容量;它们提高了多线程应用和多任务环境的计算能力,以满足要求高性能、低能耗的嵌入式应用的需求。


  • 英特尔® 虚拟化技术: 在单一硬件平台上实现多个环境以提高灵活性和系统利用率。
  • 英特尔® 可信执行技术: 实现测量启动和保护执行等安全性功能。
  • 英特尔® 高级智能高速缓存: 通过动态分配共享的二级高速缓存而提高系统性能。
  • 英特尔® 64 架构: 支持 64 位指令。

交互式结构图



文档(Document)

序号 PDF 描述
1 Application Note: AP-485 Intel® Processor Identification and CPUID Instruction     Application Note: AP-485 Intel® Processor Identification and CPUID Instruction
2 Application Note: Designing Embedded Systems for Testability     Application Note: Designing Embedded Systems for Testability
3 Datasheet: Intel® 4 Series Express Chipset Family     Datasheet: Intel® 4 Series Express Chipset Family
4 Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
5 Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
6 Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and      Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series
7 Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and      Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series
8 Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family     Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family
9 Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual     Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual
10 Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide     Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide
11 Power Profiling for Embedded Applications     Power Profiling for Embedded Applications
12 Product Brief: Intel® 82576 Gigabit Ethernet Controller     Product Brief: Intel® 82576 Gigabit Ethernet Controller
13 Product Brief: Intel® 82576 Gigabit Ethernet Controller     Product Brief: Intel® 82576 Gigabit Ethernet Controller
14 Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/     Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/SCADA Industrial Panel PC
15 Specification Update: Intel® 82576 Gigabit Ethernet Controller     Specification Update: Intel® 82576 Gigabit Ethernet Controller
16 Specification Update: Intel® 82576 Gigabit Ethernet Controller     Specification Update: Intel® 82576 Gigabit Ethernet Controller
17 Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor     Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series -NDA
18 Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family     Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family
19 Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family     Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family
20 Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family     Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family
21 White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets     White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
22 White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model     White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model
23 White Paper: Choosing the Right Storage Solution for Your Embedded Application     White Paper: Choosing the Right Storage Solution for Your Embedded Application
24 White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs     White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
25 White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms     White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
26 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
27 White Paper: Designing Systems without a Suspend Supply     White Paper: Designing Systems without a Suspend Supply
28 White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles     White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
29 White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms     White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
30 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
31 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
32 White Paper: Interfacing I²C Devices to Intel's SMBus Controller     White Paper: Interfacing I²C Devices to Intel's SMBus Controller
33 White Paper: JTAG 101     White Paper: JTAG 101
34 White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization     White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
35 White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons     White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
36 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
37 White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture     White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems
38 White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts     White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
39 White Paper: Seven Tips to Get Started on Embedded Multi-Core     White Paper: Seven Tips to Get Started on Embedded Multi-Core
40 White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines     White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
41 White Paper: Thermal Design Considerations for Embedded Applications     White Paper: Thermal Design Considerations for Embedded Applications
42 White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane     White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane
43 产品简介: 适用于嵌入式计算的英特尔® Q45 高速芯片组     产品简介: 适用于嵌入式计算的英特尔® Q45 高速芯片组
44 产品简介: 适用于嵌入式计算的英特尔® Q45 高速芯片组     产品简介: 适用于嵌入式计算的英特尔® Q45 高速芯片组
45 产品简介: 英特尔® 奔腾® 处理器 E6500、E5300 和 E2160     产品简介: 英特尔® 奔腾® 处理器 E6500、E5300 和 E2160
46 支持嵌入式计算的 英特尔® 酷睿™2 四核处理器 Q9400     支持嵌入式计算的 英特尔® 酷睿™2 四核处理器 Q9400
47 支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300     支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300

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