AU80586GE025D

品牌:Intel
描述:Intel? Atom? Processor N270 (512K Cache, 1.60 GHz, 533 MHz FSB)
包装:
封装:
无铅情况/ROHS: 有铅
类别:凌动处理器
经营商:科通芯城自营
参数 数值
# of Cores 1
# of Processing Die Transistors 47 million
# of Threads 2
Bus/Core Ratio 12
Clock Speed 1.6 GHz
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Execute Disable Bit Yes
FSB Parity No
FSB Speed 533 MHz
Idle States No
Instruction Set 32-bit
Instruction Set Extensions SSE2, SSE3, SSSE4
Intel® 64 No
Intel® Demand Based Switching No
Intel® Hyper-Threading Technology Yes
Intel® Trusted Execution Technology No
Intel® Turbo Boost Technology No
Intel® Virtualization Technology (VT-x) No
Intel® Virtualization Technology for Directed I/O (VT-d) No
L2 Cache 512 KB
Launch Date Q2'08
Lithography 45 nm
Low Halogen Options Available See MDDS
Max TDP 2.5 W
Package Size 22mm x 22mm
Processing Die Size 26 mm 2
Processor Number N270
Recommended Customer Price TRAY: $32
Sockets Supported PBGA437
Status Launched
Supplemental SKU No
T JUNCTION 90°C
Thermal Monitoring Technologies Yes
VID Voltage Range 0.9V-1.1625V

基于 45 纳米技术的单核处理器(主频:1.6 GHz;TDP:2.5 瓦)经过能耗优化,可提供出色的性能功耗比。此平台提供丰富的 I/O 功能、32 位 3D 显卡和 DDR2 支持 — 是众多嵌入式市场领域的理想选择。


  • 英特尔® 超线程技术: 在多任务环境中提高系统响应性能
  • 能耗优化: 支持增强型英特尔 SpeedStep® 技术,低能耗睡眠状态(C1E、C2E、C4E)二级高速缓存动态调整
  • 英特尔® 单指令多数据流扩展(SSE)2 和英特尔® SSE3: 在复杂计算和视频解码中加快数据处理速度

交互式结构图



文档(Document)

序号 PDF 描述
1 Application Note: Designing Embedded Systems for Testability     Application Note: Designing Embedded Systems for Testability
2 Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boo     Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X
3 Datasheet: Intel® 82583V Gigabit Ethernet Controller     Datasheet: Intel® 82583V Gigabit Ethernet Controller
4 Datasheet: Intel® I/O Controller Hub 7 (ICH7)     Datasheet: Intel® I/O Controller Hub 7 (ICH7)
5 Datasheet: Mobile Intel® Atom™ Processor N270 Single Core     Datasheet: Mobile Intel® Atom™ Processor N270 Single Core
6 Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platfo     Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform
7 Power Profiling for Embedded Applications     Power Profiling for Embedded Applications
8 Product Brief: Intel® 82583V Gigabit Ethernet Controller     Product Brief: Intel® 82583V Gigabit Ethernet Controller
9 Product Brief: Intel® 82583V Gigabit Ethernet Controller     Product Brief: Intel® 82583V Gigabit Ethernet Controller
10 Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology     Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology
11 Specification Update: Intel® 82583V Gigabit Ethernet Controller     Specification Update: Intel® 82583V Gigabit Ethernet Controller
12 Specification Update: Intel® Atom™ Processor N270 Series     Specification Update: Intel® Atom™ Processor N270 Series
13 Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family     Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family
14 Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series     Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series
15 White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets     White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
16 White Paper: Choosing the Right Storage Solution for Your Embedded Application     White Paper: Choosing the Right Storage Solution for Your Embedded Application
17 White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms     White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
18 White Paper: Designing Systems without a Suspend Supply     White Paper: Designing Systems without a Suspend Supply
19 White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles     White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
20 White Paper: Fanless Cooling for Embedded Applications     White Paper: Fanless Cooling for Embedded Applications
21 White Paper: Fanless Cooling for Embedded Applications     White Paper: Fanless Cooling for Embedded Applications
22 White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms     White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
23 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
24 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
25 White Paper: Interfacing I²C Devices to Intel's SMBus Controller     White Paper: Interfacing I²C Devices to Intel's SMBus Controller
26 White Paper: JTAG 101     White Paper: JTAG 101
27 White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization     White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
28 White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons     White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
29 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
30 White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts     White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
31 White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines     White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
32 White Paper: Thermal Design Considerations for Embedded Applications     White Paper: Thermal Design Considerations for Embedded Applications
33 产品简介: 适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组     产品简介: 适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组
34 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件     英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件
35 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件     英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件
36 用于嵌入式计算的英特尔® 凌动™     用于嵌入式计算的英特尔® 凌动™

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