| 参数 | 数值 |
|---|---|
| # of Cores | 2 |
| # of Displays Supported | 3 |
| # of Memory Channels | 2 |
| # of PCI Express Ports | 1 |
| # of Threads | 4 |
| 4G WiMAX Wireless Technology | No |
| AES New Instructions | Yes |
| Bus/Core Ratio | 25 |
| Clock Speed | 2.5 GHz |
| DMI | 5 GT/s |
| Dual Display Capable | Yes |
| ECC Memory Supported | Yes |
| Embedded Options Available | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Execute Disable Bit | Yes |
| Graphics and IMC Lithography | 22nm |
| Graphics Base Frequency | 550 MHz |
| Graphics Max Dynamic Frequency | 1 GHz |
| Graphics Output | eDP/DP/HDMI/SDVO/CRT |
| Idle States | Yes |
| Instruction Set | 64-bit |
| Instruction Set Extensions | AVX |
| Intel® 64 | Yes |
| Intel® Anti-Theft Technology | No |
| Intel® Clear Video HD Technology | Yes |
| Intel® Clear Video Technology for MID | No |
| Intel® Demand Based Switching | No |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
| Intel® Flexible Display Interface (Intel® FDI) | Yes |
| Intel® Hyper-Threading Technology | Yes |
| Intel® Insider™ | No |
| Intel® InTru™ 3D Technology | Yes |
| Intel® My WiFi Technology | Yes |
| Intel® Quick Sync Video | Yes |
| Intel® Smart Cache | 4 MB |
| Intel® Trusted Execution Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® vPro Technology | Yes |
| Intel® VT-x with Extended Page Tables (EPT) | Yes |
| Intel® Wireless Display | No |
| Launch Date | Q2'12 |
| Lithography | 22nm |
| Low Halogen Options Available | See MDDS |
| Max CPU Configuration | 1 |
| Max Memory Bandwidth | 25.6 GB/s |
| Max Memory Size (dependent on memory type) | 32 GB |
| Max TDP | 25 W |
| Max Turbo Frequency | 3.2 GHz |
| Memory Types | DDR3/DDR3L - 1333/1600 |
| Package Size | 31.0mm x 24.0mm |
| PCI Express Configurations | 1x16, 2x8, 1x8 2x4 |
| PCI Express Revision | 3.0 |
| Processor Graphics | Intel® HD Graphics 4000 |
| Processor Number | i7-3555LE |
| Recommended Customer Price | TRAY: $360 |
| Sockets Supported | FCBGA1023 |
| Status | Launched |
| T JUNCTION | 105°C |
| Thermal Monitoring Technologies | Yes |
这些低功耗处理器基于原名为 Ivy Bridge 的英特尔® 微体系结构，后者采用具有 3D 晶体管的 22 纳米处理技术。此平台提供了高性能、远程可管理性和安全性、ECC 内存和节能功能，是各种不同的移动智能应用程序的理想选择。
| 序号 | 描述 | |
|---|---|---|
| 1 |
 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
|
Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection |
| 2 |
Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor
|
Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor |
| 3 |
Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2
|
Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2 |
| 4 |
Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2
|
Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2 |
| 5 |
Datasheet: Intel® 7 Series and Intel® C216 Chipset
|
Datasheet: Intel® 7 Series and Intel® C216 Chipset |
| 6 |
Datasheet: Intel® 82579 Gigabit Ethernet PHY
|
Datasheet: Intel® 82579 Gigabit Ethernet PHY |
| 7 |
Schematic: Intel® 82579 Gigabit Ethernet PHY
|
Schematic: Intel® 82579 Gigabit Ethernet PHY |
| 8 |
Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family
|
Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family |
| 9 |
Specification Update: Intel® 7 Series and Intel® C216 Chipset
|
Specification Update: Intel® 7 Series and Intel® C216 Chipset |
| 10 |
White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage
|
White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage |
| 11 |
平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器
|
平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器 |
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