第三代英特尔® 酷睿™ 处理器采用具有 3D 晶体管的 22 纳米处理技术，可提供远超前代的一流计算、集成型媒体和图形性能，而且支持新一代 I/O 技术、更高分辨率独立显示器和增强型安全性和管理功能。
| 序号 | 描述 | |
|---|---|---|
| 1 |
 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
|
Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection |
| 2 |
Application Power Guideline Addendum: Intel® Core™ i7 Processor 3770
|
Application Power Guideline Addendum: Intel® Core™ i7 Processor 3770 |
| 3 |
Datasheet: 3rd Generation Intel® Core™ Processor (Desktop) Family Datasheet - Volume 1 of 2
|
Datasheet: 3rd Generation Intel® Core™ Processor (Desktop) Family Datasheet - Volume 1 of 2 |
| 4 |
Datasheet: 3rd Generation Intel® Core™ Processor (Desktop) Family Datasheet - Volume 2 of 2
|
Datasheet: 3rd Generation Intel® Core™ Processor (Desktop) Family Datasheet - Volume 2 of 2 |
| 5 |
Datasheet: Intel® 7 Series and Intel® C216 Chipset
|
Datasheet: Intel® 7 Series and Intel® C216 Chipset |
| 6 |
Datasheet: Intel® 82579 Gigabit Ethernet PHY
|
Datasheet: Intel® 82579 Gigabit Ethernet PHY |
| 7 |
Schematic: Intel® 82579 Gigabit Ethernet PHY
|
Schematic: Intel® 82579 Gigabit Ethernet PHY |
| 8 |
Specification Update: 3rd Generation Intel® Core™ Processor (Desktop) Family
|
Specification Update: 3rd Generation Intel® Core™ Processor (Desktop) Family |
| 9 |
Specification Update: Intel® 7 Series and Intel® C216 Chipset
|
Specification Update: Intel® 7 Series and Intel® C216 Chipset |
| 10 |
Thermal Mechanical Specification and Design Guidelines: Intel® 7 Series (Desktop) and Intel® C216 Ch
|
Thermal Mechanical Specification and Design Guidelines: Intel® 7 Series (Desktop) and Intel® C216 Chipset |
| 11 |
Thermal Mechanical Specifications and Design Guidelines (TMSDG): 3rd Generation Intel® Core™ Process
|
Thermal Mechanical Specifications and Design Guidelines (TMSDG): 3rd Generation Intel® Core™ Processor (Desktop) Family and LGA1155 Socket |
| 12 |
White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage
|
White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage |
| 13 |
平台简介:采用移动式英特尔® B75 和 英特尔® Q77高速芯片组
|
平台简介:采用移动式英特尔® B75 和 英特尔® Q77高速芯片组 |
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