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BD82QM67

品牌:Intel
描述:Intel? BD82QM67 PCH
包装:
封装:
无铅情况/ROHS: 有铅
类别:芯片组
经营商:科通芯城自营
参数 数值
# of PCI Express Ports 8
# of SATA Ports 6
# of USB Ports 14
Dual Display Capable Yes
Embedded Options Available Yes
Graphics Output LVDS, CRT, Display Port, DVI, HDMI, SVDO
Intel® Active Management Technology Yes
Intel® AMT Version 7.x
Intel® Anti-Theft Technology Yes
Intel® HD Audio Technology Yes
Intel® Rapid Storage Technology Yes
Intel® Trusted Execution Technology Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® vPro Technology Yes
Launch Date 02/20/2011
Low Halogen Options Available See MDDS
Max TDP 3.9 W
Package Size 25mm x 25mm
PCI Express Configurations x1, x2, x4
PCI Express Revision 2.0
PCI Support No
Recommended Customer Price T&R : $48
Status Launched
Supplemental SKU No
USB Revision 2.0

这些低功耗处理器基于采用 32 纳米技术的英特尔® 微体系(代号:Sandy Bridge)。此平台提供了高性能、远程可管理性和安全性、ECC 和节能功能,是各种不同的嵌入式应用程序的理想选择。


  • 英特尔® 高级矢量扩展: 加速浮点计算的性能。
  • 英特尔® 核芯显卡 3000 和英特尔® 快速同步视频: 支持高端增强视频和图形功能,并提高性能。
  • 英特尔® 睿频加速技术 2.0: 利用可用的温度余地以更高的频率更快地运行应用程序。
  • 英特尔® 博锐™ 技术: 为关键的安全性和远程管理功能提供前所未有的硬件支持。

交互式结构图



文档(Document)

序号 PDF 描述
1 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection     Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
2 Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor     Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor
3 Application Power Guideline Addendum: Intel® Celeron® Processor 807UE     Application Power Guideline Addendum: Intel® Celeron® Processor 807UE
4 Application Power Guideline Addendum: Intel® Celeron® Processor 827E     Application Power Guideline Addendum: Intel® Celeron® Processor 827E
5 Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC     Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC
6 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2     Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2
7 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2     Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2
8 Datasheet: Intel® 6 Series and Intel® C200 Series Chipset     Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
9 Datasheet: Intel® 82579 Gigabit Ethernet PHY     Datasheet: Intel® 82579 Gigabit Ethernet PHY
10 Schematic: Intel® 82579 Gigabit Ethernet PHY     Schematic: Intel® 82579 Gigabit Ethernet PHY
11 Solution Brief: Going Beyond Exceptional Computing Performance     Solution Brief: Going Beyond Exceptional Computing Performance
12 Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family     Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family
13 Specification Update: Intel® 6 Series and Intel® C200 Series Chipset     Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
14 Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family     Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family
15 Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser     Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
16 User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Ki     User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit
17 White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs     White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
18 White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family     White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family
19 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
20 White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors     White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
21 White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors     White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
22 White Paper: High Performance Storage Encryption on Intel® Architecture Processors     White Paper: High Performance Storage Encryption on Intel® Architecture Processors
23 White Paper: Intel® Virtualization Technology for Directed I/O     White Paper: Intel® Virtualization Technology for Directed I/O
24 White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors     White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
25 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
26 White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa     White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux*
27 产品简介: 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件     产品简介: 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件
28 产品简介: 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件     产品简介: 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件
29 平台简介: 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组     平台简介: 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组
30 平台简介:采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。     平台简介:采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。

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