CM8062300834106

品牌:Intel
描述:Intel? Core? i5-2400 Processor (6M Cache, up to 3.40 GHz)
包装:
封装:
无铅情况/ROHS: 有铅
类别:酷睿处理器
经营商:科通芯城自营
参数 数值
# of Cores 4
# of Displays Supported 2
# of Memory Channels 2
# of PCI Express Ports 1
# of Threads 4
AES New Instructions Yes
Bus/Core Ratio 31
Clock Speed 3.1 GHz
Datasheet Url Link
DMI 5 GT/s
Dual Display Capable Yes
ECC Memory Supported No
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Execute Disable Bit Yes
Graphics Base Frequency 850 MHz
Graphics Max Dynamic Frequency 1.1 GHz
Idle States Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Intel® 64 Yes
Intel® Clear Video HD Technology Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Hyper-Threading Technology No
Intel® Insider™ Yes
Intel® InTru™ 3D Technology Yes
Intel® Quick Sync Video Yes
Intel® Smart Cache 6 MB
Intel® Trusted Execution Technology Yes
Intel® Turbo Boost Technology 2.0
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® vPro Technology Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® Wireless Display No
Launch Date Q1'11
Lithography 32 nm
Low Halogen Options Available See MDDS
Max CPU Configuration 1
Max Memory Bandwidth 21 GB/s
Max Memory Size (dependent on memory type) 32 GB
Max TDP 95 W
Max Turbo Frequency 3.4 GHz
Memory Types DDR3-1066/1333
Package Size 37.5mm x 37.5mm
PCI Express Revision 2.0
Processor Graphics Intel® HD Graphics 2000
Processor Number i5-2400
Recommended Customer Price TRAY: $184 BOX : $195
Sockets Supported LGA1155
Status Launched
T CASE 72.6°C
Thermal Monitoring Technologies Yes

这些基于英特尔® 微体系(代号:Sandy Bridge)的处理器支持四核和双核配置,可增强媒体和图形功能、降低平台的整体能耗和空闲能耗。观看视频


  • 英特尔® 高级矢量扩展: 为信号和图形处理应用加快计算处理速度。
  • 英特尔® 高速视频同步技术: 提高媒体性能、为其它任务提供 CPU 可用性。
  • 英特尔® 睿频加速技术 2.0: 以更高的频率来提高应用程序运行速度。
  • 英特尔® 博锐™ 技术: 为关键的安全性和管理功能提供前所未有的硬件支持。

交互式结构图



文档(Document)

序号 PDF 描述
1 " 产品简介: 英特尔® 奔腾® 处理器 G850 与英特尔® C206,英特尔® Q67 Express,英特尔® B65 Express 和英特尔® H61 高速芯片组 "     " 产品简介: 英特尔® 奔腾® 处理器 G850 与英特尔® C206,英特尔® Q67 Express,英特尔® B65 Express 和英特尔® H61 高速芯片组 "
2 Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture     Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture - System Bring-up Guide
3 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection     Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
4 Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Rem     Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Remote Areas
5 Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2     Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2
6 Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2     Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2
7 Datasheet: Intel® 6 Series and Intel® C200 Series Chipset     Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
8 Datasheet: Intel® 82579 Gigabit Ethernet PHY     Datasheet: Intel® 82579 Gigabit Ethernet PHY
9 Schematic: Intel® 82579 Gigabit Ethernet PHY     Schematic: Intel® 82579 Gigabit Ethernet PHY
10 Solution Brief: Going Beyond Exceptional Computing Performance     Solution Brief: Going Beyond Exceptional Computing Performance
11 Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family     Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family
12 Specification Update: Intel® 6 Series and Intel® C200 Series Chipset     Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
13 Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Process     Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Processor (Desktop) Family and LGA1155 Socket
14 Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser     Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
15 White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs     White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
16 White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family     White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family
17 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
18 White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors     White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
19 White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics     White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics
20 White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors     White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
21 White Paper: High Performance Storage Encryption on Intel® Architecture Processors     White Paper: High Performance Storage Encryption on Intel® Architecture Processors
22 White Paper: Intel® Virtualization Technology for Directed I/O     White Paper: Intel® Virtualization Technology for Directed I/O
23 White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors     White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
24 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
25 White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa     White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux*
26 产品简介: 面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台     产品简介: 面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台
27 产品简介: 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组     产品简介: 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组

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