CM8062307262003

品牌:Intel
描述:Intel? Xeon? Processor E3-1275 (8M Cache, 3.40 GHz)
包装:
封装:
无铅情况/ROHS: 有铅
类别:至强处理器
经营商:科通芯城自营
参数 数值
# of Cores 4
# of Displays Supported 2
# of Memory Channels 2
# of PCI Express Ports 2
# of Threads 8
AES New Instructions Yes
Bus/Core Ratio 34
Clock Speed 3.4 GHz
Datasheet Url Link
DMI 5 GT/s
Dual Display Capable Yes
ECC Memory Supported Yes
Embedded Options Available Yes
Execute Disable Bit Yes
Graphics Base Frequency 850 MHz
Graphics Max Dynamic Frequency 1.35 GHz
Idle States Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Intel® 64 Yes
Intel® Clear Video HD Technology Yes
Intel® Demand Based Switching Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Hyper-Threading Technology Yes
Intel® InTru™ 3D Technology Yes
Intel® Quick Sync Video Yes
Intel® Smart Cache 8 MB
Intel® Trusted Execution Technology Yes
Intel® Turbo Boost Technology 2.0
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® vPro Technology Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® Wireless Display No
Launch Date Q2'11
Lithography 32 nm
Low Halogen Options Available See MDDS
Max CPU Configuration 1
Max Memory Bandwidth 21 GB/s
Max Memory Size (dependent on memory type) 32 GB
Max TDP 95 W
Max Turbo Frequency 3.8 GHz
Memory Types DDR3-1066/1333
Package Size 37.5mm x 37.5mm
PCI Express Revision 2.0
Processor Graphics Intel® HD Graphics P3000
Processor Number E3-1275
Recommended Customer Price TRAY: $339 BOX : $350
Sockets Supported LGA1155
Status Launched
T CASE 72.6°C
Thermal Monitoring Technologies Yes

这些四核处理器支持英特尔® 核芯显卡 P3000/2000、英特尔® 高级矢量扩展和英特尔® AES – 用于增强媒体、提高性能和改善安全性的新指令。它们提供灵活的 20 通道 PCI Express* 功能和 DDR3 内存支持。观看视频


  • 内存纠错: 在无需重置系统的情况下校正内存错误 (ECC)
  • 英特尔® 睿频加速技术 2.0: 利用可用的温度余地以更高的频率更快地运行应用程序
  • 英特尔® 博锐™ 技术: 为关键的安全性和远程管理功能提供前所未有的硬件支持
  • 英特尔® 智能节能技术: 通过改进架构减少待机耗电量

交互式结构图



文档(Document)

序号 PDF 描述
1 " 产品简介: 英特尔® 奔腾® 处理器 G850 与英特尔® C206,英特尔® Q67 Express,英特尔® B65 Express 和英特尔® H61 高速芯片组 "     " 产品简介: 英特尔® 奔腾® 处理器 G850 与英特尔® C206,英特尔® Q67 Express,英特尔® B65 Express 和英特尔® H61 高速芯片组 "
2 Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture     Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture - System Bring-up Guide
3 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection     Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
4 Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers     Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers
5 Datasheet: Intel® 6 Series and Intel® C200 Series Chipset     Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
6 Datasheet: Intel® 82579 Gigabit Ethernet PHY     Datasheet: Intel® 82579 Gigabit Ethernet PHY
7 Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 1 of 2     Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 1 of 2
8 Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 2 of 2     Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 2 of 2
9 Schematic: Intel® 82579 Gigabit Ethernet PHY     Schematic: Intel® 82579 Gigabit Ethernet PHY
10 Solution Brief: Going Beyond Exceptional Computing Performance     Solution Brief: Going Beyond Exceptional Computing Performance
11 Specification Update: Intel® 6 Series and Intel® C200 Series Chipset     Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
12 Specification Update: Intel® Xeon® Processor E3-1200 Family     Specification Update: Intel® Xeon® Processor E3-1200 Family
13 Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser     Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
14 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
15 White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors     White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
16 White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors     White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
17 White Paper: High Performance Storage Encryption on Intel® Architecture Processors     White Paper: High Performance Storage Encryption on Intel® Architecture Processors
18 White Paper: Intel® Virtualization Technology for Directed I/O     White Paper: Intel® Virtualization Technology for Directed I/O
19 White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors     White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
20 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
21 产品简介: 英特尔® 至强® 处理器 E3-1200 系列与英特尔® C206 芯片组     产品简介: 英特尔® 至强® 处理器 E3-1200 系列与英特尔® C206 芯片组
22 产品简介: 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组     产品简介: 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组

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