处理器-酷睿处理器-CN80617004467AC

参数	数值
# of Cores	2
# of Displays Supported	2
# of Graphics and IMC Die Transistors	177 million
# of Memory Channels	2
# of PCI Express Ports	1
# of Processing Die Transistors	382 million
# of Threads	4
AES New Instructions	No
Bus/Core Ratio	16
Clock Speed	2.13 GHz
Datasheet Url	Link
DMI	2.5 GT/s
Dual Display Capable	Yes
ECC Memory Supported	Yes
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Execute Disable Bit	Yes
Graphics and IMC Die Size	114 mm 2
Graphics and IMC Lithography	45 nm
Graphics Base Frequency	500 MHz
Graphics Max Dynamic Frequency	667 MHz
Idle States	Yes
Instruction Set	64-bit
Instruction Set Extensions	SSE4.1,SSE4.2
Integrated Graphics	Yes
Intel® 64	Yes
Intel® Clear Video HD Technology	Yes
Intel® Fast Memory Access	Yes
Intel® Flex Memory Access	Yes
Intel® Flexible Display Interface (Intel® FDI)	Yes
Intel® Hyper-Threading Technology	Yes
Intel® Smart Cache	3 MB
Intel® Trusted Execution Technology	No
Intel® Turbo Boost Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	No
Intel® vPro Technology	No
Intel® VT-x with Extended Page Tables (EPT)	Yes
Launch Date	Q1'10
Lithography	32 nm
Low Halogen Options Available	See MDDS
Macrovision* License Required	No
Max CPU Configuration	1
Max Memory Bandwidth	17.1 GB/s
Max Memory Size (dependent on memory type)	8 GB
Max TDP	35 W
Memory Types	DDR3-800/1066
Package Size	BGA 34mmX28mm
PCI Express Configurations	1X16, 2X8
PCI Express Revision	2.0
Physical Address Extensions	36-bit
Processing Die Size	81 mm 2
Processor Number	i3-330E
Recommended Customer Price	TRAY: $177
Sockets Supported	BGA1288
Status	Launched
T JUNCTION	90°C for rPGA,105°C for BGA
Thermal Monitoring Technologies	Yes

体验业界标准 x86 架构的智能性能、能效、集成显卡和纠错码（ECC）内存。此双芯片平台采用英特尔® AES 新指令，以帮助加快数据加密和解密速度。

英特尔® 智能节能技术： 通过功率门限和自动低功耗状态降低空闲功耗。
英特尔® 睿频加速技术： 提高处理器频率以增强性能。
英特尔® 超线程技术： 并行多线程提高串行应用的性能。
英特尔® 博锐™ 技术： 远程管理、灵活的虚拟化以及增强的安全性功能。

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CN80617004467AC

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序号	PDF	描述
1	Application Power Guideline Addendum: Intel® Core™ i5 Processor 520E	Application Power Guideline Addendum: Intel® Core™ i5 Processor 520E
2	Datasheet Addendum Specification Update: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Ser	Datasheet Addendum Specification Update: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series
3	Datasheet Addendum: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series	Datasheet Addendum: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series
4	Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 1	Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 1
5	Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 2	Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 2
6	Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture	Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture
7	Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY	Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY
8	Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY	Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY
9	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology
10	Specification Update: Intel® 82577LM/LC Gigabit Ethernet PHY	Specification Update: Intel® 82577LM/LC Gigabit Ethernet PHY
11	Specification Update: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series	Specification Update: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series
12	User Guide: Intel® Core™ i5 Processor with Intel® QM57 Express Chipset Development Kit	User Guide: Intel® Core™ i5 Processor with Intel® QM57 Express Chipset Development Kit
13	User Guide: Intel® Core™ i7 Processor with Intel® QM57 Express Chipset Development Kit	User Guide: Intel® Core™ i7 Processor with Intel® QM57 Express Chipset Development Kit
14	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
15	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
16	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
17	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
18	White Paper: High Performance Storage Encryption on Intel® Architecture Processors	White Paper: High Performance Storage Encryption on Intel® Architecture Processors
19	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
20	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
21	产品简介：采用移动式英特尔® QM57 和移动式英特尔® HM55 高速芯片组的英特尔® 赛扬® 处理器 U3405、P4500 和 P4505	产品简介：采用移动式英特尔® QM57 和移动式英特尔® HM55 高速芯片组的英特尔® 赛扬® 处理器 U3405、P4500 和 P4505
22	产品简介：面向嵌入式计算的基于英特尔® 酷睿™ i7、英特尔® 酷睿™ i5 和英特尔® 酷睿™ i3 处理器的平台	产品简介：面向嵌入式计算的基于英特尔® 酷睿™ i7、英特尔® 酷睿™ i5 和英特尔® 酷睿™ i3 处理器的平台
23	英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件	英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件
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